2012-2016 Ph.D., Manufacturing Engineering and Management, University of New South Wales (UNSW), Australia 2009-2012 MS, Mechanical Manufacturing and Automation, Nanjing University of Aeronautics and astronautics, China 2005-2009 BS, Mechanical Engineering and Automation, Nanjing University of Aeronautics and Astronautics, China |
Focused on advanced multi-physics manufacturing technologies. My work addresses the microfabrication needs of semiconductor materials by integrating laser/ultrafast laser processing, electrochemical machining, water jet, and micro-abrasive techniques to achieve efficient, precise, and near-zero thermal-damage additive and subtractive manufacturing. Application areas include high-efficiency precision dicing, polishing, microstructure fabrication, and surface metallization of semiconductor materials. In parallel, I employ simulation approaches such as finite element analysis, finite difference methods, and molecular dynamics to investigate underlying process mechanisms. I have led 2 national-level projects and 5 provincial/ministerial-level projects, published over 60 SCI-indexed papers, and hold more than 30 granted patents. |
[1] H. Zhu, J. Wang, P. Yao, C.Z. Huang, Heat transfer and material ablation in hybrid laser-waterjet microgrooving of single crystalline germanium, International Journal of Machine Tools and Manufacture, 116 (2017) 25-39. [2] Z. Zhang, H. Zhu*, W. Zhang, et al. A review of laser-induced graphene: From experimental and theoretical fabrication processes to emerging applications. Carbon 2023; 214:118356 (ESI高被引) [3] H. Zhu*, Y. Shen, H. Sun, et al, Ultrafast laser-driven precision removal of silver coatings on ceramic substrates: synergistic experimental investigation and TTM simulation, International Journal of Heat and Mass Transfer, 2026, 255, 127758. [4] H Zhu*, D Mao, X Lu, et al. Synergistic post-processing of micro-through-slot sidewalls in Si wafers via hybrid laser-electrochemical-abrasive method: Mechanism investigation and process simulation, Journal of Manufacturing Processes, 2025, 149, 486-501. [5] H Zhu*, J Han, J Wang, et al. Mechanisms and characterization of a novel hybrid laser-enhanced particle laden electrochemical fabrication process for high quality micro-dimples on germanium wafers, Journal of Materials Processing Technology, 2024, 328, 118392. [6] H. Zhu*, Z. Zhang, Z. Zhang, et al. Localized fabrication of flexible graphene-copper composites via a combined ultrafast laser irradiation and electrodeposition technique, Journal of Manufacturing Processes,108 (2023) 395-407. [7] H. Zhu, Z. Jiang, J. Han, et al. Fabrication of oxide-free dimple structure on germanium via electrochemical jet machining enhanced by opposing laser irradiation, Journal of Manufacturing Processes, 85 (2023) 623-635 [8] H. Zhu, Z. Zhang, J. Xu, et al. Wang, A numerical study of picosecond laser micro-grooving of single crystalline germanium: Mechanism discussion and process simulation, Journal of Manufacturing Processes, 69 (2021) 351-367. |